An LED device manufacturing method can produce an LED device that can emit light of a given color tone by additive color mixture of light emitted from an LED chip and light obtained by wavelength conversion of the light emitted from the LED chip. The wavelength conversion can be accomplished by using a wavelength conversion material, such as a fluorescent material. The LED device can have good efficiency of extracting light from the LED and can have high luminous intensity. First cups and second cups can be formed in a substrate including a pair of conductor patterns formed on an insulating portion. The first and second cups can have co-planar bottom surfaces. LED chips can be mounted on die bonding pads that are provided on the bottoms of the first cups. The die bonding pads can be connected to one of the conductor patterns. An upper electrode of each LED chip can be connected to a wire bonding pad extending from the other conductor pattern via a bonding wire. A fluorescent resin containing a transparent resin with a fluorescent material added thereto can be injected into the second cup and then dispersed to fill the first and second cups with the fluorescent resin due to the resin's natural flow. A lens made of a transparent resin can be formed above each LED chip.