发明申请
- 专利标题: Polishing apparatus and polishing method
- 专利标题(中): 抛光设备和抛光方法
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申请号: US11086420申请日: 2005-03-23
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公开(公告)号: US20060105678A1公开(公告)日: 2006-05-18
- 发明人: Tatsuya Kohama , Itsuki Kobata , Toshikazu Nomura
- 申请人: Tatsuya Kohama , Itsuki Kobata , Toshikazu Nomura
- 优先权: JP2004-334548 20041118
- 主分类号: B24B51/00
- IPC分类号: B24B51/00
摘要:
A polishing apparatus can supply a polishing liquid uniformly and efficiently to a surface to be polished of a workpiece. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding a semiconductor wafer and pressing the semiconductor wafer against the polishing surface. The polishing apparatus also includes a polishing liquid supply port for supplying a polishing liquid to the polishing surface, and a moving mechanism for moving the polishing liquid supply port to distribute the polishing liquid uniformly over an entire surface of the workpiece due to relative movement of the workpiece and the polishing surface.