发明申请
- 专利标题： Film adhesive and semiconductor package using the same
- 专利标题（中）： 薄膜粘合剂和半导体封装使用相同
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申请号： US11271943申请日： 2005-11-14
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公开(公告)号： US20060110595A1公开(公告)日： 2006-05-25
- 发明人: Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
- 申请人： Youichi Kodama , Seiji Itami , Kuniaki Sato , Syuji Tahara
- 申请人地址： JP Tokyo
- 专利权人： MITSUI CHEMICALS, INC.
- 当前专利权人： MITSUI CHEMICALS, INC.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-329030 20041112
- 主分类号： C08G69/26
- IPC分类号： C08G69/26 ; B32B7/12
摘要：
A film adhesive having an adhesive layer (C) mainly containing a thermoplastic polyimide having a glass transition temperature of not more than 100° C. and an adhesive layer (D) having a storage shear modulus of not more than 106 Pa at 50° C. Furthermore, the film adhesive further comprises a base material (A) and an adhesive layer (B). The film adhesive can exhibit excellent low-temperature adhesive property and covering capability functioning as a die bonding adhesive film which can be used in a semiconductor package. In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape.
公开/授权文献
- US07718258B2 Film adhesive and semiconductor package using the same 公开/授权日：2010-05-18
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