发明申请
- 专利标题： Method and apparatus for heating porous preform
- 专利标题（中）： 多孔预成型件的加热方法和装置
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申请号： US11222120申请日： 2005-09-08
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公开(公告)号： US20060112732A1公开(公告)日： 2006-06-01
- 发明人: Jae-Hoon Jin , Jin-Han Kim , Yeong-Seop Lee
- 申请人： Jae-Hoon Jin , Jin-Han Kim , Yeong-Seop Lee
- 专利权人： Samsung Electronics Co., LTD
- 当前专利权人： Samsung Electronics Co., LTD
- 优先权： KR2004-98178 20041126
- 主分类号： C03B37/012
- IPC分类号： C03B37/012
摘要：
A method for heating a porous preform according to the present invention comprises the steps of accommodating the porous preform in a muffle tube, forming a high temperature zone on a portion of a moving path of the muffle tube, using a heater and moving the muffle tube along the moving path to pass through the high temperature zone.