发明申请
US20060118973A1 Sheet for optical-semiconductor-element encapsulation and process for producing optical semiconductor device with the sheet
审中-公开
用于光学半导体元件封装的片材和用于制造具有片材的光学半导体器件的工艺
- 专利标题： Sheet for optical-semiconductor-element encapsulation and process for producing optical semiconductor device with the sheet
- 专利标题（中）： 用于光学半导体元件封装的片材和用于制造具有片材的光学半导体器件的工艺
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申请号： US11273082申请日： 2005-11-15
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公开(公告)号： US20060118973A1公开(公告)日： 2006-06-08
- 发明人: Noriaki Harada , Yuji Hotta , Ichiro Suehiro , Naoki Sadayori
- 申请人： Noriaki Harada , Yuji Hotta , Ichiro Suehiro , Naoki Sadayori
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 优先权： JPP.2004-329887 20041115
- 主分类号： H01L23/29
- IPC分类号： H01L23/29
摘要：
The present invention provides a sheet for optical-semiconductor-element encapsulation, which comprises: an outermost resin layer A that is to be brought into contact with one or more optical semiconductor elements; a light-diffusing layer formed on the layer A and containing light-diffusing particles; and a resin layer B formed on the light-diffusing layer and having a lower refractive index than that of the layer A. Also disclosed is a process for producing an optical semiconductor device using the sheet.
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