A reflow heating system includes a housing assembly defining an internal thermal processing chamber that encapsulates at least a microelectronic assembly on a substrate. A first heating source is coupled to the housing assembly and within the thermal processing chamber. The first heating source is biased by a force-applying assembly into engagement with the microelectronic assembly. The first heating source comprises one or more heating platens adapted to engage the microelectronic assembly for applying direct heat sufficient to melt solder. A vacuum assembly is incorporated in the heating platen for allowing application of at least a partial vacuum to the microelectronic assembly to permit withdrawal thereof from the substrate. A radiant heating source is applied beneath the substrate and a directional heating source is applied to the microelectronic assembly.