发明申请
- 专利标题： Semiconductor device and manufacturing method thereof
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US11302592申请日： 2005-12-12
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公开(公告)号： US20060125082A1公开(公告)日： 2006-06-15
- 发明人: Takeshi Wakabayashi , Ichiro Mihara
- 申请人： Takeshi Wakabayashi , Ichiro Mihara
- 申请人地址： JP Tokyo
- 专利权人： Casio Computer Co., Ltd.
- 当前专利权人： Casio Computer Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-361092 20041214; JP2004-362117 20041215
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L23/04
摘要：
A semiconductor device includes a base plate made of a material including at least a thermosetting resin, and having an opening, a vertical conductor filled and provided in the opening of the base plate, at least one semiconductor construct having a semiconductor substrate and a plurality of external connection electrodes provided on one side of the semiconductor substrate, and an insulating layer secured to and provided on a periphery of the semiconductor construct. The insulating layer is secured to the base plate, and the external connection electrodes of the semiconductor construct are bonded to the vertical conductor.
公开/授权文献
- US07459340B2 Semiconductor device and manufacturing method thereof 公开/授权日：2008-12-02