The present invention allows both the advantages of a metallic housing and those of a synthetic resin structure to be exhibited in electronic devices, home electrical devices, etc., and achieves high productivity and mass productivity and further enables a desired configuration and structure to be designed freely. As a pretreatment, a shaped aluminum alloy material is dipped in an aqueous solution of at least one selected from the group consisting of ammonia, hydrazine, and a water-soluble amine compound. A thermoplastic resin composition containing polyphenylene sulfide as a component is integrally bonded to the surface of the treated shaped aluminum alloy material by injection molding or other method. The molded article is a product made of the shaped aluminum alloy material and the thermoplastic resin composition containing PPS. Thus, the characteristic features of metal can be utilized in terms of mechanical strength and external appearance design. Moreover, a complicated configuration and structure can be formed inside the housing.