发明申请
- 专利标题: Interleaved boot block to support multiple processor architectures and method of use
- 专利标题(中): 交叉引导块支持多种处理器架构和使用方法
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申请号: US11010167申请日: 2004-12-10
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公开(公告)号: US20060129795A1公开(公告)日: 2006-06-15
- 发明人: Mallik Bulusu , Vincent Zimmer , Rahul Khanna
- 申请人: Mallik Bulusu , Vincent Zimmer , Rahul Khanna
- 申请人地址: US CA Santa Clara
- 专利权人: INTEL CORPORATION
- 当前专利权人: INTEL CORPORATION
- 当前专利权人地址: US CA Santa Clara
- 主分类号: G06F15/177
- IPC分类号: G06F15/177
摘要:
A flash memory has an interleaved boot block compatible with multiple processor architectures. The interleaved boot block may include one boot block compatible with a first CPU architecture and another boot block compatible with a second CPU architecture. These two boot blocks may be combined in an interleaved manner in the flash memory so that during a boot process only one of the two boot blocks executes, although both are stored in the flash memory. By interleaving different boot blocks, a common socket computer system capable of supporting multiple processor architectures may be achieved without fully replacing an incompatible basic input/output system (BIOS). Further, the flash memory may contain an updatable portion in which any BIOS segments incompatible with a processor architecture may be updated via a recovery, or update, process.
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