发明申请
- 专利标题： Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member
- 专利标题（中）： 透光窗构件，设置有透光窗构件的半导体封装和用于制造透光窗构件的方法
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申请号： US10548224申请日： 2005-03-02
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公开(公告)号： US20060131600A1公开(公告)日： 2006-06-22
- 发明人: Junichi Nakaoka , Kenji Ikeuchi , Makoto Takahashi
- 申请人： Junichi Nakaoka , Kenji Ikeuchi , Makoto Takahashi
- 优先权： JP2004-061567 20040306
- 国际申请： PCT/JP05/03457 WO 20050302
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A light transmission window member capable of simplifying the structure and capable of simplifying manufacturing steps is obtained. This light transmission window member (10, 10a), which is a light transmission window member employed for a semiconductor package (30, 30a), comprises a flat metal frame (2) having an opening (2a) for defining a light passage region and a glass member (1) capable of transmitting light bonded to the upper surface of the flat frame having the opening without through an adhesive to cover the opening.
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