发明申请
- 专利标题： Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component
- 专利标题（中）： 半导体晶片，电子部件，以及用于制造电子部件的分量载体
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申请号： US11291072申请日： 2005-12-01
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公开(公告)号： US20060131712A1公开(公告)日： 2006-06-22
- 发明人: Simon Jerebic , Jens Pohl , Horst Theuss
- 申请人： Simon Jerebic , Jens Pohl , Horst Theuss
- 优先权： DEDE10325541.9 20030604
- 主分类号： H01L23/06
- IPC分类号： H01L23/06
摘要：
An electronic component includes a semiconductor chip with a chip topside, an integrated circuit, and a chip backside. The chip backside includes a magnetic layer. The electronic component further includes a chip carrier with a magnetic layer on its carrier topside. At least one of the two magnetic layers is permanently magnetic such that the semiconductor chip is magnetically fixed on the chip carrier.
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