- 专利标题: Protection of seedlayer for electroplating
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申请号: US11336169申请日: 2006-01-19
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公开(公告)号: US20060131750A1公开(公告)日: 2006-06-22
- 发明人: Valery Dubin , Peter Moon
- 申请人: Valery Dubin , Peter Moon
- 主分类号: H01L23/52
- IPC分类号: H01L23/52 ; H01L21/4763
摘要:
The present invention includes a method of providing a substrate; sequentially forming a seed layer over the substrate and forming a protection layer over the seed layer; and sequentially removing the protection layer and forming a conductor over the seed layer. The present invention further includes a structure having a substrate, the substrate having a device; an insulator disposed over the substrate, the insulator having an opening, the opening disposed over the device; a barrier layer disposed over the opening; a seed layer disposed over the barrier layer; and a protection layer disposed over the seed layer.
公开/授权文献
- US07525196B2 Protection of seedlayer for electroplating 公开/授权日:2009-04-28