发明申请
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US11317078申请日: 2005-12-27
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公开(公告)号: US20060138633A1公开(公告)日: 2006-06-29
- 发明人: Mikio Naruse , Akihiro Shibuya , Motoyuki Furukawa , Yasuhiro Okada , Daigo Ueno
- 申请人: Mikio Naruse , Akihiro Shibuya , Motoyuki Furukawa , Yasuhiro Okada , Daigo Ueno
- 专利权人: NISSAN MOTOR CO., LTD.
- 当前专利权人: NISSAN MOTOR CO., LTD.
- 优先权: JP2004-379444 20041228
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
A semiconductor device includes first and second semiconductor chips formed with electrodes on front and reverse sides, a first bus bar on which the first semiconductor chip is mounted so as the reverse side electrode to be connected thereto, a second bus bar, arranged parallel with the first bus bar, on which the second semiconductor chip is mounted so as the reverse side electrode to be connected thereto, a third bus bar that is press-connected to the front side electrode of the first semiconductor chip, a fourth bus bar that is press-connected to the front side electrode of the second semiconductor chip, and a connecting section that electrically connects the first bus bar and the fourth bus bar.