发明申请
- 专利标题： Spring adapted to hold electronic device in a frame
- 专利标题（中）： 弹簧适用于将电子设备固定在一个框架中
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申请号： US11027337申请日： 2004-12-29
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公开(公告)号： US20060139886A1公开(公告)日： 2006-06-29
- 发明人: Stephan Barsun
- 申请人： Stephan Barsun
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.
公开/授权文献
- US07859847B2 Spring adapted to hold electronic device in a frame 公开/授权日：2010-12-28
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