发明申请
- 专利标题： Heat dissipation devices and fabrication methods thereof
- 专利标题（中）： 散热装置及其制造方法
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申请号： US11315244申请日： 2005-12-23
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公开(公告)号： US20060144565A1公开(公告)日： 2006-07-06
- 发明人: Hsin-Chang Tsai , Horng-Jou Wang , Darren Chen , Tai-Kang Shing
- 申请人： Hsin-Chang Tsai , Horng-Jou Wang , Darren Chen , Tai-Kang Shing
- 专利权人： DELTA ELECTRONICS, INC.
- 当前专利权人： DELTA ELECTRONICS, INC.
- 优先权： TW93141432 20041230
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; F28D15/02
摘要：
This invention id related to a heat dissipation device comprises a case having a heat dissipation path, a backflow path, a first link path, and a second link path for working fluid to circulate therein. The heat dissipation path and the backflow path are positioned in the different height levels individually. The working fluid will not be more easily have turbulence. The reduction of heat dissipation efficiency will be improved. And the working fluid will not be necessary to limit covering the liquid state and gaseous state both.
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