Disclosed herein is an coating composition for electromagnetic wave shielding, which can effectively solve the problems of electromagnetic interference (EMI) and radio frequency interference (RFI) caused by electromagnetic waves generated from the internal elements of various electronic devices. The composition contains a silver-coated copper particles having fine particle size, so that it can greatly improve the durability of an electroconductive film prepared therefrom. The coating composition comprises a polyurethane binder, a metal particles, a solvent and a rheology control agent, in which the metal particles is either a silver-coated copper particles having an average particle size of 2-20 μm or a mixture of the silver-coated particles and a silver particles having an average particle size of 2-10 μm, and the polyurethane binder is a mixture of at least two kinds of polyurethanes.