Invention Application
- Patent Title: Wound healing method and kits
- Patent Title (中): 伤口愈合方法和试剂盒
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Application No.: US10540934Application Date: 2003-12-29
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Publication No.: US20060148737A1Publication Date: 2006-07-06
- Inventor: John Harmon
- Applicant: John Harmon
- Applicant Address: US MD Baltimore 21218
- Assignee: The John Hopkins University
- Current Assignee: The John Hopkins University
- Current Assignee Address: US MD Baltimore 21218
- International Application: PCT/US03/41437 WO 20031229
- Main IPC: A61K48/00
- IPC: A61K48/00 ; A61N1/00

Abstract:
Electroporation is used to enhance the wound-healing benefit provided by transfection of nucleic acids that encode cellular growth factors. Wounds which are amenable to the method include inter alia cutaneous lesions, muscular lesions, osseus lesions, burn wounds, and gastrointestinal anastamoses. Kits comprise electrodes and nucleic acids encoding cellular growth factors.
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