- 专利标题： Pad for electrochemical processing
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申请号： US11345634申请日： 2006-01-31
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公开(公告)号： US20060151336A1公开(公告)日： 2006-07-13
- 发明人: Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
- 申请人： Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
- 主分类号： B23H3/00
- IPC分类号： B23H3/00
摘要：
Systems and methods for electrochemically processing. In one embodiment, a plurality of grooves are formed in a polishing surface of a polishing pad. The grooves are adapted to facilitate the flow of polishing fluid over the polishing pad. Conductive layers are respectively formed in the grooves, wherein the conductive layers are in electrical communication with each other.
公开/授权文献
- US20090120803A9 Pad for electrochemical processing 公开/授权日：2009-05-14