发明申请
- 专利标题： Semiconductor device with split pad design
- 专利标题（中）： 半导体器件采用分离焊盘设计
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申请号： US11035212申请日： 2005-01-13
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公开(公告)号： US20060151785A1公开(公告)日： 2006-07-13
- 发明人: Robert Campbell , Monty Hayes , John Fruth
- 申请人： Robert Campbell , Monty Hayes , John Fruth
- 主分类号： H01L23/58
- IPC分类号： H01L23/58
摘要：
A semiconductor device includes a device body, a pad and a signal distribution runner. The device body includes a plurality of parallel cells and at least one integrated electronic component. The pad is located on a surface of the device body and includes a first portion and a second portion that are electrically isolated. The signal distribution runner is electrically coupled to and extends from the first portion of the pad. The signal distribution runner provides a signal to a same terminal of each of the plurality of parallel cells. The at least one integrated electronic component is electrically coupled to the second portion of the pad.
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