发明申请
- 专利标题: WIRING PATTERNS FORMED BY SELECTIVE METAL PLATING
- 专利标题(中): 选择性金属镀层形成的接线图
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申请号: US10905590申请日: 2005-01-12
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公开(公告)号: US20060154463A1公开(公告)日: 2006-07-13
- 发明人: Toshiharu Furukawa , Mark Hakey , Steven Holmes , David Horak , Charles Koburger
- 申请人: Toshiharu Furukawa , Mark Hakey , Steven Holmes , David Horak , Charles Koburger
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L21/3205
- IPC分类号: H01L21/3205
摘要:
Conductive sidewall spacer structures are formed using a method that patterns structures (mandrels) and activates the sidewalls of the structures. Metal ions are attached to the sidewalls of the structures and these metal ions are reduced to form seed material. The structures are then trimmed and the seed material is plated to form wiring on the sidewalls of the structures.
公开/授权文献
- US07345370B2 Wiring patterns formed by selective metal plating 公开/授权日:2008-03-18