A liquid borne emulsion of varying formulations comprising a powdered metal in a base liquid incorporating a thickening agent component is adapted to a specific metal and type of electrical connection in a specific environment to enhance the electrical conductivity at the electrical connection, reducing the effect of the environment over time of the metals within the electrical connection, increasing the surface area of the electrical connection, reducing the effect of vibration upon the electrical connection to prevent separation and loss of contact to the electrical connection and reducing the signal noise generated by metal to metal movement resulting from an imperfect contact in an electrical connection.