- 专利标题: Modular surface mount manifold assemblies
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申请号: US11378198申请日: 2006-03-17
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公开(公告)号: US20060157130A1公开(公告)日: 2006-07-20
- 发明人: Paul Eidsmore , Michael Mohlenkamp , Benjamin Olechnowicz , Christine Schilt Deines , Douglas Nordstrom , James McCoy
- 申请人: Paul Eidsmore , Michael Mohlenkamp , Benjamin Olechnowicz , Christine Schilt Deines , Douglas Nordstrom , James McCoy
- 主分类号: F17D1/00
- IPC分类号: F17D1/00
摘要:
A modular manifold system is provided for interconnecting fluid components of a fluid system in a reduced area. The system is comprised of a one or more bridge fittings having an internal fluid passageway which has an inlet end in fluid communication with an outlet port of a first fluid component, and an outlet end in fluid communication with an inlet port of a second fluid component. The bridge fittings may additionally comprise two or more ports, which one of said ports may be in fluid communication with a manifold on another substrate level. The bridge fittings may be mounted within a channel of a backing plate for structural support or in channel blocks of varying sizes. An optional locator plate may be utilized which is mounted over the ends of the bridge fittings in order to align the inlet and outlet ports of the fluid components with the inlet and outlet ends of the bridge fittings. The bridge fittings may also be mounted to the locator plate in multiple directions forming multiple flow paths. Additionally, the bridge fittings may be stacked to form multiple layers where bridge fittings of one layer may be in fluid communication with bridge fittings of another layer. The invention may further comprise seals provided in a recess between the fluid ports and the mating bridge fittings ends.
公开/授权文献
- US07686041B2 Modular surface mount manifold assemblies 公开/授权日:2010-03-30
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