发明申请
US20060158865A1 Circuit board, electronic device employing circuit board, and mehtod of producing circuit board
审中-公开
电路板，采用电路板的电子设备，以及电路板生产线
- 专利标题： Circuit board, electronic device employing circuit board, and mehtod of producing circuit board
- 专利标题（中）： 电路板，采用电路板的电子设备，以及电路板生产线
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申请号： US10525329申请日： 2003-08-25
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公开(公告)号： US20060158865A1公开(公告)日： 2006-07-20
- 发明人: Tadahiro Ohmi , Shigetoshi Sugawa , Akihiro Morimoto , Takeyoshi Kato
- 申请人： Tadahiro Ohmi , Shigetoshi Sugawa , Akihiro Morimoto , Takeyoshi Kato
- 申请人地址： JP Tokyo 100-8323
- 专利权人： Tadahiro OHMI
- 当前专利权人： Tadahiro OHMI
- 当前专利权人地址： JP Tokyo 100-8323
- 优先权： JP2002-244216 20020823; JP2003-290912 20030808
- 国际申请： PCT/JP03/10687 WO 20030825
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K1/18
摘要：
A circuit board (100) having an insulator layer and a conductor (104) buried in the insulator layer, wherein the insulator layer has a first insulator (101) satisfying a relation μr≧εr, assuming εr is the dielectric constant and μr is the relative permeability, and the conductor is substantially surrounded by the first insulator.
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