The invention provides compounds which are excellent in terms of heat resistance, mechanical characteristics, electric characteristics, physical properties, etc. and which provide a novel material useful for, for example, interlayer insulating film or protective film for use in semiconductor devices, interlayer insulating film for use in multilayer wiring boards, cover coating in flexible printed circuits, or a liquid crystal alignment layer. The compounds are bis(3-amino-4-hydroxyphenyl)adamantane derivatives having a structure represented by formula (I) or (II): (each of R1 to R4 represents a halogen atom, a hydroxyl group, an alkyl group, an alkoxyl group, a carboxyl group, or an alkoxycarbonyl group, each of m and a is an integer of 0 to 3, and each of n and b is an integer of 0 to 14, with the proviso that the case where the following three conditions in formula (I) are met is excluded: R2 is methyl and present at a bridgehead; m is 0; and n is 2).