An organosilicone resin emulsion composition comprising (A) an organosilicone resin having the compositional formula: [RSiO3/2]m[R2SiO]n wherein R is a monovalent organic group, m is from 0.2 to 1.0, and n is from 0 to 0.8, (B) a water-miscible organic solvent having an SP value of 8.0-11.0, (C) an emulsifier, and (D) water, the composition being substantially free of an organic solvent other than component (B), has good water resistance, weather resistance, and stability and is free of environmental problems. An article having a coating of the composition formed thereon is also provided.