A connector with a dip-molded housing and a method for forming a twist-on wire connector with a dip-molded housing. To dip-mold a covering or housing on a twist-on wire connector either a mandrel carrying a twist-on wire coil, a mandrel having the a shape of a spiral coil or a twist-on wire connector are dipped into a bath of an in situ solidfiable dip-moldable material such as liquid plastic. The dip-moldable solidified material solidifies to form a dip-molded shell on the wire connector.