Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a circuit device can be conducted with ease even when the pitch of electrodes of the circuit device to be connected is small, and moreover good conductivity can be achieved as to all conductive parts, and insulating property between adjacent conductive parts can be surely achieved, a production process thereof, and applied products thereof. The anisotropically conductive connector is obtained by forming a molding material layer for the elastic anisotropically conductive film with conductive particles exhibiting magnetism dispersed in a liquid polymeric substance-forming material, which will become an elastic polymeric substance by a curing treatment, within the through-hole in the frame plate and at the inner peripheral edge portion about the through-hole of the frame plate, applying a magnetic field having higher intensity at a portion to become the conductive part for connection and a portion to become the part to be supported in the molding material layer, than any other portion, to the molding material layer, thereby gathering the conductive particles at the portion to become the conductive part for connection in a state that the conductive particles present in the portion to become the part to be supported have been retained in this portion, and orienting them in the thickness-wise direction, and subjecting the molding material layer to a curing treatment.