A communication device includes a first housing having a first substrate and a second housing having a second substrate, wherein the first substrate and the second substrate are connected by a signal wire including a plurality of thin electric wires, each of which is made of a conductor covered with an insulator, the plurality of thin electric wires forming the signal wire are tied in a bundle at a center portion except the ends thereof and covered with a ground wire mesh made of a plurality of conductive wires knitted into a mesh structure and the ends of the ground wire mesh are connected to the first substrate and the second substrate, respectively.