发明申请
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US11353156申请日： 2006-02-14
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公开(公告)号： US20060180864A1公开(公告)日： 2006-08-17
- 发明人: Shinya Suzuki , Kazuhisa Higuchi
- 申请人： Shinya Suzuki , Kazuhisa Higuchi
- 优先权： JP2005-037129 20050215
- 主分类号： H01L23/62
- IPC分类号： H01L23/62
摘要：
Signal lines which provide electric connections from an internal circuit formed on a main surface of a semiconductor chip and including, for example, MIS transistor to protective elements constituted by, for example, diodes are drawn out from outlet ports formed on wiring lines disposed between the protective elements, and a signal line region occupied by the signal lines is provided over the protective elements and under electrode pads. A wiring region on the main surface of the semiconductor chip can be enlarged without increasing the chip area.
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