A contact structure includes contact members having leg portions which are deflected using internal stresses. Since the internal stress is used, the leg portions of the contact members are easily and reliably deflected even when the size of the contact members is reduced in accordance with the size reduction of an electronic component. Since the leg portions are elastically deformed and function as elastic contacts, a strain caused by a difference in coefficient of thermal expansion between the electronic component and the substrate can be absorbed by the contact members. In addition, since a plurality of elastic contacts are provided, even if there is a displacement between the electronic component and the substrate, an electrical connection between the electronic component and the substrate is reliably obtained.