Invention Application
US20060183048A1 Positive photoresist composition and resist pattern formation 审中-公开
正光致抗蚀剂组合物和抗蚀剂图案形成

  • Patent Title: Positive photoresist composition and resist pattern formation
  • Patent Title (中): 正光致抗蚀剂组合物和抗蚀剂图案形成
  • Application No.: US10568126
    Application Date: 2004-08-19
  • Publication No.: US20060183048A1
    Publication Date: 2006-08-17
  • Inventor: Yasuo MasudaToshiki Okui
  • Applicant: Yasuo MasudaToshiki Okui
  • Priority: JP2003-325953 20030918
  • International Application: PCT/JP04/12235 WO 20040819
  • Main IPC: G03C5/18
  • IPC: G03C5/18
Positive photoresist composition and resist pattern formation
Abstract:
A means for increasing development velocity of a positive photoresist composition is provided which contains a photosensitive novolak resin formed by replacing some hydrogen atoms within those of all phenolic hydroxyl groups of alkali soluble novolak resin by 1,2-naphthoquinonediazide sulfonyl group. This means is positive photoresist composition and a formation method of a resist pattern using the composition which contains (A) a photosensitive novolak resin formed by replacing some hydrogen atoms within those of all phenolic hydroxyl groups of alkali soluble novolak resin by 1,2-naphthoquinonediazide sulfonyl group, which is dissolved in (B) propylene glycol alkyl ether acetate.
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