An apparatus for removing a residue from a surface of an object located on a support region within a processing chamber is disclosed. The apparatus comprises means for performing a dual-pressure cleaning process and means for performing a rinsing process. The means for performing a dual-pressure cleaning process comprises: means for pressurizing the processing chamber to a first pressure; means for introducing a cleaning chemistry into the processing chamber; means for recirculating the cleaning chemistry within the processing chamber for a first period of time; means for increasing a pressure of the processing chamber to a second pressure; and means for recirculating the cleaning chemistry within the processing chamber for a second period of time.