发明申请
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US10543592申请日： 2004-02-03
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公开(公告)号： US20060186403A1公开(公告)日： 2006-08-24
- 发明人: Takayuki Ezaki
- 申请人： Takayuki Ezaki
- 优先权： JP2003-040730 20030219
- 国际申请： PCT/JP04/01079 WO 20040203
- 主分类号： H01L23/58
- IPC分类号： H01L23/58
摘要：
When performing connection to an external substrate by heat pressure, damage to a first functional area having low resistance against an applied pressure is alleviated, and to carried out the connection with high reliability. The present invention is such that a semiconductor device has, on a substrate (10), a first functional area (1) (for example, a storage element area) and a second functional area (2) (for example, a driving circuitor signal processing circuit), wherein, if the substrate (10) is viewed in a planar fashion, a bump corresponding to an electrode for externally inputting and outputting a signal is provided in the second functional area (2) disposed inside a circumscribed rectangle of the first functional area (1).
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