发明申请
- 专利标题： Stress relief features for an overmolded base
- 专利标题（中）： 包覆成型基座的应力消除特征
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申请号： US11230838申请日： 2005-09-20
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公开(公告)号： US20060187579A1公开(公告)日： 2006-08-24
- 发明人: Mo Xu , YiRen Hong , Pohlye Lim , Niroot Jierapipatanakul
- 申请人： Mo Xu , YiRen Hong , Pohlye Lim , Niroot Jierapipatanakul
- 申请人地址： US CA Scotts Valley
- 专利权人： Seagate Technology LLC
- 当前专利权人： Seagate Technology LLC
- 当前专利权人地址： US CA Scotts Valley
- 主分类号： G11B33/14
- IPC分类号： G11B33/14
摘要：
A base assembly for use in an airtight enclosure. The base assembly includes a metal stamped section and an overmold section formed adjacent to the metal stamped section. The overmold section includes at least one stress relief feature for eliminating distortion stresses exerted on the metal stamped section by the overmold section.
公开/授权文献
- US07652845B2 Stress relief features for an overmolded base 公开/授权日：2010-01-26
信息查询
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