发明申请
- 专利标题： Method of forming electronic devices
- 专利标题（中）： 电子器件形成方法
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申请号： US11068376申请日： 2005-02-28
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公开(公告)号： US20060192280A1公开(公告)日： 2006-08-31
- 发明人: David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
- 申请人： David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/58
摘要：
A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the “reflow step” or subsequent to it (post-curing).