发明申请
- 专利标题: Polycrystalline sillicon substrate
- 专利标题(中): 多晶硅衬底
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申请号: US10530189申请日: 2003-10-10
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公开(公告)号: US20060194417A1公开(公告)日: 2006-08-31
- 发明人: Shunichi Ishihara , Katsumi Nakagawa , Hiroshi Sato , Takehito Yoshino , Shoji Nishida , Noritaka Ukiyo , Masaaki Iwane , Yukiko Iwasaki , Masaki Mizutani
- 申请人: Shunichi Ishihara , Katsumi Nakagawa , Hiroshi Sato , Takehito Yoshino , Shoji Nishida , Noritaka Ukiyo , Masaaki Iwane , Yukiko Iwasaki , Masaki Mizutani
- 申请人地址: JP Tokyo
- 专利权人: Canon Kabushiki Kaisha
- 当前专利权人: Canon Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 优先权: JPNO.2002-302286 20021016
- 国际申请: PCT/JP03/13074 WO 20031010
- 主分类号: H01L31/0376
- IPC分类号: H01L31/0376 ; H01L21/20
摘要:
A polycrystalline silicon substrate for a solar cell formed by growing a high purity polycrystalline silicon layer on a surface of a base obtained by slicing a polycrystalline silicon ingot obtained by melting metallurgical grade silicon and performing one-direction solidification, wherein one-direction solidification is performed on a melt prepared by adding B to molten metallurgical grade silicon at an amount of 2×1018 cm−3 to 5×1019 cm−3 based on the concentration in the melt to produce the polycrystalline silicon ingot. With this structure, it is possible to easily obtain a polycrystalline silicon substrate having resistivity and the type of conductivity suitable for manufacture of a solar cell.
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