发明申请
- 专利标题: Curable composition
- 专利标题(中): 可固化组合物
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申请号: US10545807申请日: 2004-02-17
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公开(公告)号: US20060194923A1公开(公告)日: 2006-08-31
- 发明人: Kei Hirata , Koji Kitayama , Mizuho Maeda
- 申请人: Kei Hirata , Koji Kitayama , Mizuho Maeda
- 申请人地址: JP Okayama 710-8622
- 专利权人: Kuraray Co., Ltd.
- 当前专利权人: Kuraray Co., Ltd.
- 当前专利权人地址: JP Okayama 710-8622
- 优先权: JP2003-54354 20030228; JP2003-107892 20031104
- 国际申请: PCT/JP04/01708 WO 20040217
- 主分类号: C08L37/00
- IPC分类号: C08L37/00
摘要:
A curable composition includes (A) a (meth)acrylate, (B) a radical polymerization initiator, (C) an epoxidized polyisoprene containing an epoxy group at 0.15 to 2.5 meq/g in the molecule and having a number-average molecular weight of 15000 to 200000, and (D) a curing accelerator. The curable composition shows high elongation and excellent rubber elasticity even in a cured state and has superior compatibility, transparency, waterproofness and flexibility, so that cracks and separation of cured products are reduced. Accordingly, the composition is suitable for use as adhesives, coating agents, encapsulating materials, inks, sealing materials and the like.
公开/授权文献
- US08013075B2 Curable composition 公开/授权日:2011-09-06
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