发明申请
US20060194933A1 Thermosetting epoxy resin composition and transparent material
审中-公开
热固性环氧树脂组合物和透明材料
- 专利标题： Thermosetting epoxy resin composition and transparent material
- 专利标题（中）： 热固性环氧树脂组合物和透明材料
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申请号： US10567253申请日： 2004-08-23
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公开(公告)号： US20060194933A1公开(公告)日： 2006-08-31
- 发明人: Hideyuki Takai , Hisashi Maeshima
- 申请人： Hideyuki Takai , Hisashi Maeshima
- 优先权： JP2003-300473 20030825
- 国际申请： PCT/JP04/12426 WO 20040823
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; B32B27/38
摘要：
A thermosetting resin composition of this invention contains 100 parts by weight of composition (E), 0.01 to 20 parts by weight of a cationic polymerization initiator (C), and, where necessary, 50 parts by weight or less of an epoxy-containing acrylic resin (D), the composition (E) contains 10 to 99 percent by weight of an ester-free alicyclic epoxy compound (A), and 90 to 1 percent by weight of an epoxy compound (B) differing from (A). A cured article thereof is excellent in heat resistance, dimensional stability, and optical transparency and can be used as a replacement for glass substrates.
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