- 专利标题： DENSE SEMICONDUCTOR FUSE ARRAY
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申请号： US10906718申请日： 2005-03-03
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公开(公告)号： US20060197179A1公开(公告)日： 2006-09-07
- 发明人: Byeongju Park , Chandrasekharan Kothandaraman , Subramanian Iyer
- 申请人： Byeongju Park , Chandrasekharan Kothandaraman , Subramanian Iyer
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L29/00
- IPC分类号： H01L29/00
摘要：
The present invention provides a dense semiconductor fuse array having common cathodes. The dense semiconductor fuse array of the present invention occupies less area than conventional semiconductor fuse arrays, can comprise integrated diodic components, and can require only one metal wiring layer for making electrical connections to the fuse array.
公开/授权文献
- US07227207B2 Dense semiconductor fuse array 公开/授权日：2007-06-05
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