发明申请
- 专利标题： Pad conditioner for chemical mechanical polishing apparatus
- 专利标题（中）： 化学机械抛光装置垫垫调节剂
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申请号： US11368704申请日： 2006-03-07
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公开(公告)号： US20060199482A1公开(公告)日： 2006-09-07
- 发明人: Sung-Taek Moon , Dong-Jun Lee , Jae-Hyun So , Kyoung-Moon Kang , Bong-Su Ahn
- 申请人： Sung-Taek Moon , Dong-Jun Lee , Jae-Hyun So , Kyoung-Moon Kang , Bong-Su Ahn
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 优先权： KR2005-18785 20050307
- 主分类号： B24B29/00
- IPC分类号： B24B29/00
摘要：
A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relatively regular shaped and tough polishing particles may be provided on the edge portion of the surface and the relatively irregular shaped and friable polishing particles may be provided on the center portion of the surface.
公开/授权文献
- US07261621B2 Pad conditioner for chemical mechanical polishing apparatus 公开/授权日：2007-08-28
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