发明申请
US20060201914A1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
审中-公开
化学机械抛光水性分散体，化学机械抛光方法和制备化学机械抛光水性分散体的试剂盒
- 专利标题： Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
- 专利标题（中）： 化学机械抛光水性分散体，化学机械抛光方法和制备化学机械抛光水性分散体的试剂盒
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申请号： US11369870申请日： 2006-03-08
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公开(公告)号： US20060201914A1公开(公告)日： 2006-09-14
- 发明人: Kazuhito Uchikura , Masayuki Hattori , Nobuo Kawahashi
- 申请人： Kazuhito Uchikura , Masayuki Hattori , Nobuo Kawahashi
- 申请人地址： JP Chuo-ku
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP Chuo-ku
- 优先权： JP2005-64754 20050309
- 主分类号： C09K13/00
- IPC分类号： C09K13/00 ; C03C15/00 ; B44C1/22
摘要：
A chemical mechanical polishing aqueous dispersion, including: (A) abrasives; (B) an organic acid; (C) benzotriazole or a benzotriazole derivative; (D) a poly(meth)acrylate; (E) an oxidizing agent; and (F) water, the abrasives (A) being included in the chemical mechanical polishing aqueous dispersion in an amount of 2 to 10 wt %.
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