Example embodiments of a semiconductor chip packaging apparatus and method thereof are disclosed. The packaging apparatus includes a plating unit that is disposed in a direction to form a conductive plating layer on external terminals of the semiconductor chip package; and a reflow unit that is disposed with the plating unit to melt the conductive plating layer. The packaging apparatus may further include a rinsing unit that is disposed with the plating unit to clean and cool the conductive plating layer. Thus, it is possible to effectively suppress the growth of whiskers on the plating layer of the external terminals, and to secure economical efficiency, reducing costs, and allowing mass production.