发明申请
US20060202334A1 METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME
审中-公开
形成重排布和半导体芯片的方法和使用其制造的安装结构
- 专利标题： METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME
- 专利标题（中）： 形成重排布和半导体芯片的方法和使用其制造的安装结构
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申请号： US11421680申请日： 2006-06-01
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公开(公告)号： US20060202334A1公开(公告)日： 2006-09-14
- 发明人: Yong-Hwan KWON , Sa-Yoon Kang , Chung-Sun Lee
- 申请人： Yong-Hwan KWON , Sa-Yoon Kang , Chung-Sun Lee
- 申请人地址： KR Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR2003-50496 20030723
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
Provided are a method of forming a bump whose upper surface is substantially flat and whose area can be enlarged in a uniform pad pitch to simplify mounting a liquid crystal display drive IC (LDI) and a semiconductor chip and a mount structure using the method to minimize a pad area inside the chip. Thus, the pad area on an edge of a conventional chip is minimized and the bump is formed in a substantially flat location inside the chip and an electrical connection between the pad and the bump is performed by a redistribution metal line.
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