发明申请
- 专利标题： PROCESS AND APPARATUS FOR THINNING A SEMICONDUCTOR WORKPIECE
- 专利标题（中）： 用于修复半导体工件的工艺和设备
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申请号： US11420512申请日： 2006-05-26
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公开(公告)号： US20060203418A1公开(公告)日： 2006-09-14
- 发明人: Kert Dolechek , Raymon Thompson
- 申请人： Kert Dolechek , Raymon Thompson
- 申请人地址： US MT Kalispell
- 专利权人： SEMITOOL, INC.
- 当前专利权人： SEMITOOL, INC.
- 当前专利权人地址： US MT Kalispell
- 主分类号： H01L21/683
- IPC分类号： H01L21/683
摘要：
The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.
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