发明申请
- 专利标题： Preparation of semiconductor device
- 专利标题（中）： 半导体器件的制备
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申请号： US11360413申请日： 2006-02-24
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公开(公告)号： US20060205237A1公开(公告)日： 2006-09-14
- 发明人: Kinya Kodama , Tsutomu Kashiwagi , Katsuyuki Imazawa
- 申请人： Kinya Kodama , Tsutomu Kashiwagi , Katsuyuki Imazawa
- 专利权人： Shin-Etsu Chemical Co, Ltd.
- 当前专利权人： Shin-Etsu Chemical Co, Ltd.
- 优先权： JP2005-067587 20050310
- 主分类号： H01L21/31
- IPC分类号： H01L21/31 ; H01L21/469
摘要：
In the preparation of a semiconductor device comprising a semiconductor member, the semiconductor member is subjected to plasma treatment and then primer treatment, prior to the encapsulation thereof with an encapsulant. The semiconductor device, typically LED package, is highly reliable in that a firm bond is established between the semiconductor member and the encapsulant resin.
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