发明申请
- 专利标题： METHOD OF PROCESSING SEMICONDUCTOR WAFER
- 专利标题（中）： 加工半导体波形的方法
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申请号： US11079995申请日： 2005-03-14
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公开(公告)号： US20060206228A1公开(公告)日： 2006-09-14
- 发明人: Hong Ma , Meisheng Zhou
- 申请人： Hong Ma , Meisheng Zhou
- 主分类号： G06F19/00
- IPC分类号： G06F19/00
摘要：
A method of processing a semiconductor wafer is provided. The semiconductor wafer is processed with a first process. After collecting the measured data that reflects the deviation of each part within the semiconductor wafer, the semiconductor wafer is processed with a second process according to the measured data to compensate the deviation from the first process and to correct any deviation in the semiconductor wafer.
公开/授权文献
- US07142940B2 Method of processing semiconductor wafer 公开/授权日：2006-11-28
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