发明申请
- 专利标题： Method of manufacturing a wiring board, a wiring board, a circuit element and a communications device
- 专利标题（中）： 制造布线板，布线板，电路元件和通信装置的方法
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申请号： US11373521申请日： 2006-03-10
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公开(公告)号： US20060209520A1公开(公告)日： 2006-09-21
- 发明人: Taku Masai , Koji Sano
- 申请人： Taku Masai , Koji Sano
- 申请人地址： JP Kyoto
- 专利权人： OMRON Corporation
- 当前专利权人： OMRON Corporation
- 当前专利权人地址： JP Kyoto
- 优先权： JP2005-071692 20050314
- 主分类号： H05K7/06
- IPC分类号： H05K7/06
摘要：
A circuit element comprises a wiring board; the wiring board comprises a substrate and a wiring formed on the substrate, and a lid joined on the substrate containing a part of the wiring with a binder and making a sealed space above the substrate, wherein if a spot of the wiring joined with the lid by a binder is a spot of junction, a flank of both flanks of the wiring comprise bends in the spot of junction.
公开/授权文献
- US07900350B2 Method of manufacturing a wiring board 公开/授权日：2011-03-08
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