发明申请
US20060213685A1 Single or multi-layer printed circuit board with improved edge via design
审中-公开
单层或多层印刷电路板，具有改进的边缘通孔设计
- 专利标题： Single or multi-layer printed circuit board with improved edge via design
- 专利标题（中）： 单层或多层印刷电路板，具有改进的边缘通孔设计
-
申请号： US11442016申请日： 2006-05-26
-
公开(公告)号： US20060213685A1公开(公告)日： 2006-09-28
- 发明人: Alan Wang , Kevin Olson
- 申请人： Alan Wang , Kevin Olson
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.
公开/授权文献
- US1274507A Water-circulation system for internal-combustion engines. 公开/授权日：1918-08-06