发明申请
- 专利标题: Integrated DC/DC converter substrate connections
- 专利标题(中): 集成DC / DC转换器基板连接
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申请号: US11282804申请日: 2005-11-18
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公开(公告)号: US20060214253A1公开(公告)日: 2006-09-28
- 发明人: John Camagna , Sajol Ghoshal
- 申请人: John Camagna , Sajol Ghoshal
- 专利权人: Akros Silicon, Inc.
- 当前专利权人: Akros Silicon, Inc.
- 主分类号: H01L29/00
- IPC分类号: H01L29/00
摘要:
Embodiments of the present invention provide an integrated circuit (IC) having an integrated DC-DC power converter therein. This IC is operable to support the distribution of combined power and data signals in a network environment such as an Ethernet network according to protocols such as the power over Ethernet (PoE) protocol. The IC includes a DC-DC power converter, a power feed circuit, and a network physical layer (PHY) module, wherein the PHY module may contain fine line structures susceptible to damage when exposed to excessive voltages. To prevent or reduce the likelihood of damage to the PHY module from voltages supplied to the DC-DC power converter, a common substrate ground is shared between the IC components.
公开/授权文献
- US07368798B2 Integrated DC/DC converter substrate connections 公开/授权日:2008-05-06