发明申请
US20060214308A1 Flip-chip semiconductor package and method for fabricating the same
审中-公开
倒装芯片半导体封装及其制造方法
- 专利标题： Flip-chip semiconductor package and method for fabricating the same
- 专利标题（中）： 倒装芯片半导体封装及其制造方法
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申请号： US11347735申请日： 2006-02-02
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公开(公告)号： US20060214308A1公开(公告)日： 2006-09-28
- 发明人: Kuo-Hua Yu , Chin-Te Chen , Han-Ping Pu , Cheng-Hsu Hsiao
- 申请人： Kuo-Hua Yu , Chin-Te Chen , Han-Ping Pu , Cheng-Hsu Hsiao
- 申请人地址： TW Taichung
- 专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址： TW Taichung
- 优先权： TW094108915 20050323
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A flip-chip semiconductor package and a method for fabricating the same are proposed. A flux is formed on surfaces of solder bumps mounted on an active surface of a semiconductor chip, wherein the acid number of the flux is greater than 20 and the viscosity of the flux is greater than 40. When the chip is electrically connected to a lead frame via the solder bumps by a reflowing process, the flux allows the chip to be effectively fixed to the lead frame and makes the solder bumps not easily wetted to the lead frame during the reflowing process, so as to prevent over-collapsing of the solder bumps.